Socket LGA2011-3

Serverový konfigurátor Product SKUs MBD-X10DDW-iN -B X10DDW-iN (Bulk Pack) Physical Stats Form Factor Proprietary WIO Dimensions 12.8" x 13.4" (32.5cm x 34.0cm) Processor/Cache CPU Intel® Xeon® processor E5-2600 v3 family (up to 145W TDP **) Dual Socket R3 (LGA 2011) Cores / Cache Up to 18 Cores / Up to 45MB Cache System Bus

Serverový konfigurátor 1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Intel® C612 chipset 3. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots 4. 1x PCI-E 3.0 x16, 6x PCI-E 3.0 x8 slots 5. Intel® i350 Dual port GbE LAN 6. 10x SATA3 (6Gbps) ports w/

Serverový konfigurátor Key Features 1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Intel® C612 chipset 3. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots 4. 1x PCI-E 3.0 x16, 6x PCI-E 3.0 x8 slots 5. Intel® X540 Dual port 10GBase-T 6. 10x SATA3 (6

Serverový konfigurátor Key Features 1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Intel® C612 chipset 3. Up to 1TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 8x DIMM slots 4. 1x PCI-E 3.0 x16, 2x PCI-E 3.0 x8, 1x PCI-E 3.0 x4 (in x8 slot), 1x PCI-E 2.0 x4

Serverový konfigurátor Key Features Intel® Xeon® Processor Scalable Family, Single Socket P (LGA 3647) supported, CPU TDP support 205W Intel® C622 chipset Up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 8x DIMM slots Expansion slots: 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x16 (x16 || x8), 1 PCI-E 3.0 x8 (x0 || x8),

Serverový konfigurátor Key Features 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support Up to 205W TDP, 3 UPI up to 10.4 GT/s Intel® C621 Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR

Serverový konfigurátor 1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v3 family; QPI up to 9.6GT/s 2. Intel® C612 chipset 3. Up to 1TB ECC DDR4 2133MHz; 16x DIMM slots 4. 1x PCI-E 3.0 x16, 6x PCI-E 3.0 x8 slots 5. Intel® i350 Dual port GbE LAN 6. 10x SATA3 (6Gbps) ports w/ Intel C612 controller

Serverový konfigurátor Form Factor E-ATX 305W x 330D (mm) CPU AMD EPYC™ 7000 series processor family Single processor, 14nm Up to 32-core, 64 threads TDP up to 180W NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable Socket Socket SP3 Chipset System on Chip Memory 16 x DIMM slots DDR4 memory supported o

Serverový konfigurátor Key Features Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s Intel® C622 Up to 1.5TB 3DS ECC RDIMM and DDR4-2666MHz, Up to 1.5TB 3DS ECC LRDIMM, in 12 DIMM slots 1 PCI-E 3.0 x32 Left Riser Slot, 1 PCI-E 3.0 x16 Right Riser Slo

Serverový konfigurátor PNY PART NUMBER VCQK420-PB SPECIFICATIONS GPU Memory 1 GB DDR3 Memory Interface 128-bit Memory Bandwidth 29.0 GB/s NVIDIA CUDA® Cores 192 System Interface PCI Express 2.0 x16 Max Power Consumption 41 W Thermal Solution Ultra-Quiet Active Fansink Form Factor 2.713” H × 6.3” L, Single Slot, Low Profile D

Serverový konfigurátor Specifications and Solutions Tab CUDA Cores 1792 Peak Single Precision FP32 Performance 5.3 TFLOPS Multi-GPU Scalability NVIDIA SLI HB GPU Memory 8 GB GDDR5 Memory Interface 256-bit Memory Bandwidth 243 GB/s System Interface PCI Express 3.0 x16 Maximum Power Consumption 105 W Energy Star Enabling Yes The

Serverový konfigurátor Product SKUs MBD-X10DAi -B X10DAi (Bulk Pack) Physical Stats Form Factor E-ATX Dimensions 12" x 13" (30.5cm x 33.0cm) Processor/Cache CPU Intel® Xeon® processor E5-2600 v3 family (up to 160W TDP **) Dual Socket R3 (LGA 2011) Cores / Cache Up to 18 Cores / Up to 45MB Cache System Bus QPI up to 9.6 GT/s